|
|
|
| The following notes are intended merely to stress the most important and general aspects Of good microswitch installation procedure and to provide some helpful additional information. |
|
|
Installation of snap action Microswitches should only be carried out by competent personnel.
Pre-Loading of the microswitch actuator must be avoided. The actuating medium must be able to operate the microswitch through the operating position into over-travel and then to retract far enough to allow the microswitch to regain its free position. Saia-Burgess recommends that the actuating medium should drive the snap action microswitch into at least 50% of the available over-travel. All ratings shown are based on the use of all the available over-travel.
|
|
|
Side mounting shanp action Microswitches should be mounted on smooth, firm, flat surfaces using the recommended screw size. Avoid over tightening the screws. For added security they should be locked using epoxy resin. Do not attempt to enlarge microswitch mounting holes and avoid over stressing the switch. Use insulating material between the microswitch and metallic plates to increase clearance on switches with open terminals.
When soldering, over-heating of the snap action microswitch insulation must be avoided. In certain circumstances, it may be advisable to use a heat shunt. For optimum mechanical strength the conductor should be wrapped round the tip of the terminal taking care to avoid loose strands of wire. The soldering iron tip should be applied to the end of the terminal while simultaneously applying solder. Remove the iron as soon as the solder has wetted the conductor and terminal end. A soldering iron tip temperature of 350*C (260*C/5 seconds for PCB Terminals) applied for a maximum of 2-3 seconds should be adequate.
|
|
